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Chemical Mechanical Planarization Equipment

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List all items of this typeCMP Polishers

in Chemical Mechanical Planarization Equipment

1   F* Regensburg, BY
Westech Avanti 472:

200 Wafer Size Single Wafer Polishing; Polish Arm/Wafer Carrier; Load/Unload Station; Primary/Final Polish Table (22.5"/20.625"); Carrier Clean Station; APP1000 Pad Conditioner; Adjustable Parameters: Polish Arm Downforce and Backpressure; Polish Platen Rotational Speed; Polish Platen Temperature; Wafer Carrier Assembly Rotation Speed; Polish Arm Assembly Oscillation Speed and Distance; Slurry Pump Output; APP1000 Pad Profiling; Alarm Band Width, NOVAScan 210 ITM system (inline measuring system) for installation inside the unload water track,

*   Vendor Role: Mfr is Manufacturer; Sup is Supplier/Distributor; OEM is Original Equipment Manufacturer

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Items from the following manufacturers are offered under Chemical Mechanical Planarization Equipment: