How to post on WWX
Latest Listings!
 Fast¬†¬†FIND      full search   tips    
in  ALL  ONLY C M Planarization Eq
Serving  Our Guest Log in    RegisterHow to post your own listings   View prices in  or ...    
ALL CATEGORIES   Semiconductor Mfg   Wafer Fabrication Eq   View   Search-by-Specs    Input    Edit    
View All Offers Under

Chemical Mechanical Planarization Equipment


» Switch Major Category
Click an item's ID# below for its full specifications and source, or:

Group Offers into sub-categories under Chemical Mechanical Planarization EquipmentGroup Offers into sub-categories under Chemical Mechanical Planarization Equipment

List all 1 product types under Chemical Mechanical Planarization EquipmentList all 1 product types under Chemical Mechanical Planarization Equipment


  • To sort on a column, click the column head; click it again to reverse the sort.
  • Click the links under the Product Type column head to see other like items of that type.
 Offered (box) or Wanted (coins)  Item ID  Photo Short Description Product Type / Details # Price Notes Location
Make Model
  $  
166286
Peter Wolters AG  

Peter Wolters AG  

PM300 Apollo 

List all items of this typeCMP Polishers

in Chemical Mechanical Planarization Equipment

1   F* Regensburg, BY
Peter Wolters PM300 Apollo

300mm;two side / chambers; dry in dry out; 2 step polishing; with touch-up platen;
Polishing head: Wafer diameter 300 mm; Rotating speed 0 - 125 rpm; Backside pressure 0 - 200 kPa; Polishing downforce 300 - 4000 N 
Main polishing tables 1+2: Diameter  900 mm; Rotating speed 0 - 125 rpm; 
Temperature control  20 - 60 °C (Chiller);End Point Detection  Motorcurrent 
Secondary polishing table: Diameter  430 mm; Rotating speed 0 - 125 rpm; Temperature control  20 - 60 °C (Chiller)
Pad conditioner:Down force  0 - 350 N Disc diameter  120 mm Rotating speed  0 - 80 rpm  High pressure conditioning  0 - 100 bar 
SECS II  /  GEM, CIM

167779
IPEC/Westech  

IPEC/Westech  

AVANTI 472 

List all items of this typeCMP Polishers

in Chemical Mechanical Planarization Equipment

1   F* Regensburg, BY
Westech Avanti 472

200 Wafer Size Single Wafer Polishing; Polish Arm/Wafer Carrier; Load/Unload Station; Primary/Final Polish Table (22.5"/20.625"); Carrier Clean Station; APP1000 Pad Conditioner; Adjustable Parameters: Polish Arm Downforce and Backpressure; Polish Platen Rotational Speed; Polish Platen Temperature; Wafer Carrier Assembly Rotation Speed; Polish Arm Assembly Oscillation Speed and Distance; Slurry Pump Output; APP1000 Pad Profiling; Alarm Band Width, NOVAScan 210 ITM system (inline measuring system) for installation inside the unload water track,


*   Vendor Role: Mfr is Manufacturer; Sup is Supplier/Distributor; OEM is Original Equipment Manufacturer

NOTE:
   photo available
   reference document attached
  F* if the item is specially featured
  N* if the item is newly added, and/or
  R* if the item's price is recently reduced.

Items from the following manufacturers are offered under Chemical Mechanical Planarization Equipment:
IPEC/Westech, Peter Wolters AG