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Chemical Mechanical Planarization Equipment


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List all 1 product types under Chemical Mechanical Planarization EquipmentList all 1 product types under Chemical Mechanical Planarization Equipment


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     Offered (box) or Wanted (coins)  Item ID  Photo Short Description Product Type / Details # Price Notes Location
    Make Model
      $  
    166286

    Peter Wolters AG  

    PM300 Apollo 

    List all items of this typeCMP Polishers

    in Chemical Mechanical Planarization Equipment

    1 F* Regensburg, BY
    Peter Wolters PM300 Apollo

    300mm;two side / chambers; dry in dry out; 2 step polishing; with touch-up platen;
    Polishing head: Wafer diameter 300 mm; Rotating speed 0 - 125 rpm; Backside pressure 0 - 200 kPa; Polishing downforce 300 - 4000 N 
    Main polishing tables 1+2: Diameter  900 mm; Rotating speed 0 - 125 rpm; 
    Temperature control  20 - 60 °C (Chiller);End Point Detection  Motorcurrent 
    Secondary polishing table: Diameter  430 mm; Rotating speed 0 - 125 rpm; Temperature control  20 - 60 °C (Chiller)
    Pad conditioner:Down force  0 - 350 N Disc diameter  120 mm Rotating speed  0 - 80 rpm  High pressure conditioning  0 - 100 bar 
    SECS II  /  GEM, CIM

    167779

    IPEC/Westech  

    AVANTI 472 

    List all items of this typeCMP Polishers

    in Chemical Mechanical Planarization Equipment

    1 F* Regensburg, BY
    Westech Avanti 472

    200 Wafer Size Single Wafer Polishing; Polish Arm/Wafer Carrier; Load/Unload Station; Primary/Final Polish Table (22.5"/20.625"); Carrier Clean Station; APP1000 Pad Conditioner; Adjustable Parameters: Polish Arm Downforce and Backpressure; Polish Platen Rotational Speed; Polish Platen Temperature; Wafer Carrier Assembly Rotation Speed; Polish Arm Assembly Oscillation Speed and Distance; Slurry Pump Output; APP1000 Pad Profiling; Alarm Band Width, NOVAScan 210 ITM system (inline measuring system) for installation inside the unload water track,

    177229

    IPEC/Westech  

    AVANTI 472 

    List all items of this typeCMP Polishers

    in Chemical Mechanical Planarization Equipment

    1 Regensburg, BY
    Westech Avanti 472

    200 Wafer Size Single Wafer Polishing; Polish Arm/Wafer Carrier; Load/Unload Station; Primary/Final Polish Table (22.5"/20.625"); Carrier Clean Station; APP1000 Pad Conditioner; Adjustable Parameters: Polish Arm Downforce and Backpressure; Polish Platen Rotational Speed; Polish Platen Temperature; Wafer Carrier Assembly Rotation Speed; Polish Arm Assembly Oscillation Speed and Distance; Slurry Pump Output; APP1000 Pad Profiling; Alarm Band Width.

    177230

    IPEC Westech  

    AVANTI 472 

    List all items of this typeCMP Polishers

    in Chemical Mechanical Planarization Equipment

    1 N* Regensburg, Bavaria
    Westech Avanti 472
    200 Wafer Size Single Wafer Polishing; Polish Arm/Wafer Carrier; Load/Unload Station; Primary/Final Polish Table (22.5"/20.625"); Carrier Clean Station; APP1000 Pad Conditioner; Adjustable Parameters: Polish Arm Downforce and Backpressure; Polish Platen Rotational Speed; Polish Platen Temperature; Wafer Carrier Assembly Rotation Speed; Polish Arm Assembly Oscillation Speed and Distance; Slurry Pump Output; APP1000 Pad Profiling; Alarm Band Width.


    *   Vendor Role: Mfr is Manufacturer; Sup is Supplier/Distributor; OEM is Original Equipment Manufacturer

    NOTE:
       photo available
       reference document attached
      F* if the item is specially featured
      N* if the item is newly added, and/or
      R* if the item's price is recently reduced.

    Items from the following manufacturers are offered under Chemical Mechanical Planarization Equipment:
    IPEC Westech, IPEC/Westech, Peter Wolters AG