 |
Item ID |
Photo |
Short Description |
Product Type / Details |
#
|
Price |
Notes |
Location |
Make |
Model |
|
|
$ |
|
 |
255419
|
ESEC
|
ESEC |
2007 ESEC |
in Flip Chip Bonders
2007 ESEC Die Bonder:Serial Number | Model | Manufacture | 205940 | 2007 | ESEC |
|
1
|
|
|
 |
Tijuana, Baja California |
|
 |
255584
|
ESEC
|
ESEC |
2007 |
in Flip Chip Bonders
2007 ESEC Die Bonder:Serial Number | Model | Manufacturer | 208424 | 2007 | ESEC |
|
1
|
|
|
 |
Tijuana, Baja California |
|
 |
255585
|
ESEC
|
ESEC |
2007 |
in Flip Chip Bonders
2007 ESEC Die Bonder:Serial Number | Model | Manufacturer | | 2007 | ESEC |
|
1
|
|
|
 |
Tijuana, Baja California |
|
 |
255586
|
ESEC
|
ESEC |
2007 |
in Flip Chip Bonders
2007 ESEC Die Bonder:Serial Number | Model | Manufacturer | 204882 | 2007 | ESEC |
|
1
|
|
|
 |
Tijuana, Baja California |
|
 |
255587
|
ESEC
|
ESEC |
2007 |
in Flip Chip Bonders
|
1
|
|
|
 |
Tijuana, Baja California |
|
 |
255588
|
ESEC
|
ESEC |
2007 |
in Flip Chip Bonders
|
1
|
|
|
 |
Tijuana, Baja California |
|
 |
256626
|
ESEC
|
ESEC |
2007 |
in Flip Chip Bonders
2007 ESEC Die Bonder:2007 ESEC Die Bonder
|
1
|
|
|
N* |
Tijuana, Baja California |
|
 |
3317
|
Alphasem
|
Alphasem |
Swissline 9006 |
in Epoxy Die Bonders
Alphasem Swissline 9006:Automatic Epoxy Die Bonder
|
1
|
|
|
F* |
Plano, TX |
|
 |
255414
|
BESI
|
BESI |
Datacon 2200 evo plus |
in Epoxy Die Bonders
BESI Datacon 2200 evo plus Automatic Die Bonder:BESI Datacon 2200 evo plus Automatic Die Bonder - Newer Used in Prodcution
- Die Attach, Flip Chip & Multi-Chip Capability
- Upgraded Camera
- Upgraded Image Processing Unit
- Large Format Heated Stage
- Thermal Compensation
- Open Platform Architecture
|
1
|
|
|
 |
Plano, Texas |
|
 |
255417
|
ESEC
|
ESEC |
ESEC 2007 |
in Flip Chip Bonders
ESEC 2007 DIE BONDER:Serial Number | Model | Manufacturer | 205940 | 2007 | ESEC |
|
1
|
|
|
 |
Tijuana, Baja California |
|
 |
122185
|
ESEC
|
ESEC |
Cat 2000 |
in Eutectic Die Bonders
ESEC Cat 2000:Die Attacher
|
3
|
|
|
F* |
Plano, TX |
|
 |
43059
|
Hybond
|
Hybond |
EDB 140A |
in Epoxy Die Bonders
HYBOND SEMIAUTOMATIC EPOXY DIE BONDER:Semiautomatic Epoxy Die Bonder
|
1
|
|
|
F* |
Scotia, New York |
|
 |
120257
|
Kulicke & Soffa
|
Kulicke & Soffa |
6495 |
in Epoxy Die Bonders
K&S 6495:Semiautomatic Epoxy Die Bonder with PRS
|
1
|
|
|
F* |
Plano, TX |
|
 |
120258
|
Kulicke & Soffa
|
Kulicke & Soffa |
6495 |
in Epoxy Die Bonders
K&S 6495:Semiautomatic Epoxy Die Bonder
|
1
|
|
|
 |
Plano, TX |
|
 |
64751
|
Kulicke & Soffa
|
Kulicke & Soffa |
6496 |
in Flip Chip Bonders
K&S 6496 Die Bonder - Parts Tool Only:Semi-Automatic Hybrid Epoxy Die Bonder - PARTS TOOL ONLY
|
1
|
|
|
F* |
Plano, TX |
|
 |
120396
|
Kulicke & Soffa
|
Kulicke & Soffa |
6497 |
in Flip Chip Bonders
K&S 6497:Semiautomatic Flip Chip Die Bonder
|
1
|
|
|
F* |
Plano, TX |
|
 |
189121
|
Mech-El
|
Mech-El |
709 |
in Eutectic Die Bonders
MECH-EL EUTECTIC DIE BONDER:The Mech-El/MEI 709 is a manual eutectic die attacher. The machine comes with a 2 position slide table for die presentation and heated work holder. The MEI 709 uses a unique hot gas head that allows the user to heat the package to a temperature below the wetting temperature of the solder and use the hot gas to bring the localized heat to only the die area to wet the solder or perform.
|
1
|
|
|
F* |
Scotia, New York |
|
 |
186724
|
West-Bond
|
West-Bond |
7200A |
in Epoxy Die Bonders
West-Bond:West-Bond 7200A Manual Epoxy Die Bonder
|
1
|
|
|
|
Plano, TX |
|