ALL CATEGORIES

KLA-Tencor 2138XP Brightfield Defect Inspection Tool

• 0.25µ, 0.39µ, 0.62µ Spot Sizes
• For 150mm & 200mm Wafers
• Model 2552UI User Interface
• Denkenseiki Noise Filter
• Please Inquire for Additional Details

KLA-TENCOR ASET-F5x Thin Film Measurement System

• Serial Number 0202802R
• Manufactured in June, 2002
• Inspection Modes Include:
  • Dual Beam Spectrometry
  • Spectroscopic Ellipsometry
  • Film Stress Analysis
• SUMMIT™ Application Software Version 3.21.16
• FTML Version 3.46.06
• Model 300DFF1P Wafer Loading Platform
  • Dual Loadports for 300mm Wafers
  • Three Axis Wafer Handling Robot
• GEM / SECS Communication
• Inquire for Additional Details

KLA-TENCOR Aleris 8350 Advanced Film Metrology Tool

• Dual 300 mm Loadports
• Wafer Level Reliability
• Broadband Spectroscopic Ellipsometer
• Single Wave Ellipsometer
• Stress Measurement
• iDesorber

KLA Altair 8920i AOI Tool

• For 200mm & 300mm Patterned & Unpatterned Wafers
• Brightfield/Darkfield Optics
• 2X, 3.5X, 5X & 10X Objectives
• 35X Review Capability
• 0.4 um Max DF Sensitivity
• Die to Die Detection Algorithm
• Focus Tracking
• RBB Defect Classification
• 18 WPH Throughput

KLA-Tencor DSW16E 300mm Calibration Wafer

• Part Number 0210691-000 (Advanced Technology Development)
• For Use on e-Beam Patterned Wafer Defect Inspection Tools 

   

Offline defect review station

KLA-Tencor AIT Patterned Wafer Inspection Tool

• Call for Details

KLA-TENCOR HRP-240 High Resolution Profiler

• Cassette to Cassette Wafer Handling for up to 200mm Wafers
• Previously Configured for SMIF Wafer Handling
• Please Inquire for Additional Details

Thickness Measurement

KLA-Tencor ART Power Supply Module

• 3ea Available
• 1ea Refurbished 

KLA-Tencor 52-0466 DBS Spectrometer Lid 

KLA-TENCOR Auto RS-75tc Resistivity Mapping Tool

Please Inquire for Details

eS32 is a top-of-the-line mask and wafer inspection equipment that is designed to meet the most stringent quality standards for semiconductor product manufacturing. This system provides comprehensive, high-resolution inspection of both masks and wafers with unparalleled accuracy. The unit uses a proprietary optical probe to scan masks and wafers to detect defects and irregularities with a resolution reaching down to 1 micron. This high-precision scanning allows for comprehensive inspection of the entire surface of both the mask and wafer. The machine also includes powerful image processing and analysis algorithms which automatically detect defects, categorize them, and track their locations. KLA eS32 also includes a suite of automated defect correction tools which can rapidly repair standard and complex defects. In addition to its exhaustive defect detection capabilities, this tool also allows for statistical process control (SPC) analysis to ensure production processes maintain consistent quality and accuracy over time. TENCOR ES 32 also includes a user-friendly interface that makes it easy to operate and manage the asset. This user interface is highly customizable, allowing users to quickly change model settings, view detailed inspection reports, and receive real-time notifications of detected defects. In summary, KLA ES 32 is a high-performance mask and wafer inspection equipment that offers superior detection accuracy, automated defect correction, comprehensive statistical process control (SPC) analysis, and an easy-to-use user interface. This system can be used to monitor production lines, resulting in improved manufacturing quality, increased yield, and cost savings.

KLA-TENCOR Surfscan SP1 Unpatterned Wafer Surface Defect Tool

• Dual Port 200mm

KLA-TENCOR Puma 9120 IS Darkfield Inspection Tool

• For 200mm or 300mm Wafers
• 2ea Cameras
• Please Inquire for Additional Details

›Automatic Surface Inspection System

›Bare Wafer Surface Defect Inspection System

›Substrate/Sizes: 6" and 8" Wafer Capable

›Thickness: SEMI Standard Wafer Thickness

›Throughput: 100 wph (200 mm) at 0.12 mm

›Illumination Source: 30 mW Argon-Ion laser, 488 nm Wavelength

›Automatic Surface Inspection System

›Bare Wafer Surface Defect Inspection System

›Substrate/Sizes: 6" and 8" Wafer Capable

›Thickness: SEMI Standard Wafer Thickness

›Throughput: 100 wph (200 mm) at 0.12 mm

›Illumination Source: 30 mW Argon-Ion laser, 488 nm Wavelength

AIT II w/ ADC. Defect Inspection Tool

AIT II w/ ADC. Defect Inspection

KLA-Tencor AIT II w/ ADC. Defect Inspection

Film thickness measurement