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Items from the following manufacturers are offered under Wafer Fabrication Equipment:
Absopulse Electronics Ltd.,
Acopian,
Advanced Energy,
AG Associates,
Airco Temescal,
Akrion,
AMAT,
AP&S Customized Solutions,
Applied Materials, Inc.,
ASM,
ASML,
Astex,
Asyst Technologies,
Axcelis Technologies GmbH,
Axcelis/Eaton,
Branson/IPC,
Brooks Automation,
Bruce (BTI),
Canon,
CFM Technologies,
CHA Industries,
Cober,
Condor,
Daihen,
Dainippon Screen Mfg. Co., Ltd.,
DNS,
Dockweiler Chemicals,
E&R Engineering,
Electronic Measurements Inc,
ENI Power Systems,
EVG,
FSI,
GCA/Precision Scientific,
Gerling,
Hamatech,
Headway,
Hewlett Packard,
Hitachi High-Technologies,
Hitachi Kokusai Elec,
HNL Inc.,
Imtec Acculine,
Inficon,
InnerSense,
ITEC Powertron,
LAM Research Corp.,
Lambda,
Lasertec,
Leatherwood Plastics,
Leybold,
Mactronix,
March Instruments,
Materials Research Corp,
MKS Instruments, Inc.,
Modutek,
Muegge,
National Electronics,
New England Affiliated Technologies,
Nexx Systems,
Nikon,
Nikon,
Oerlikon,
Olympus,
Oxford Instruments,
Plasma-finish Enterprise,
Plasma-Therm,
PlasmaQuest,
Power Ten Inc,
Power-One Inc,
Quintel,
RECIF,
Reynoldstech,
Sairem,
Semi-Tool,
Semitool,
Seren,
Silicon Valley Group,
SMC,
Solitec,
Sorensen,
Specialty Coating Systems,
Spectra Gases,
Stackpole,
Surface Technology Systems,
Suss MicroTec,
Takatori,
Tamarack Scientific,
TDK-Lambda,
Technics,
Tel,
Telemark,
Temescal,
Tepla,
Terra Universal Inc.,
Tokyo Electron Limited,
Tokyo Electronics Limited,
Ulvac,
Unknown,
Varian,
Verteq,
Yield Engineering Systems
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